For the purpose of making LibreCube projects modular and compatible to each other, we are working on the definition of the LibreCube Board Specification. It specifies the requirements of such boards in terms of mechanical, electrical, and communication interface.
I had to disable the user registration and public editing permission for the wiki, due to spam bots that destroyed the wiki several times. (Even with captcha etc.). Hence one cannot edit directly in the wiki.
We (Phase 4 Space) are looking at cubesat specifications. We are 6U and HEO/GEO.
The connectors seem large. We are interested in the reasoning for these connectors.
We have high power chips and are looking at things like pyrolytic graphene sheets. How to get the heat out is a high priority. It’s not as critical for 1U, but for larger payloads and higher power devices (SDRs and making microwaves) it is. Is there a way to address heat dissipation in an upcoming revision of this specification?
Radiation hardening through shielding. We need it from a variety of sources, from space qualification to careful COTS to shielding and I’m sure there’s more. Could the scope of this specification possibly be expanded to include radiation hardening through shielding as a part of the LibreCube effort?
Thanks for your feedback. In reply to your questions:
The connectors are historic, and we like to keep them because they are rigid, and have heritage.
Heat dissipation must be solved on individual cases. The spec is really just a minimum to make boards compatible.
Same as 2., its a case by case problem.
We are currently developing a Power Control and Distribution Unit (PCDU), and will see how that drives the pinout of the connectors (ie. power lines). Feel free to make proposals as well.
Hi all,
we are about to manufacture the next SatNOGS COMMS iteration and this is a good chance to improve compatibility with other projects.
Is the documented information up to date regarding pinout?
What is the latest source of truth document?